Flexible Printed Thermoelectric Cooling Film
AI Overview
This RFP seeks development of lightweight, flexible thermoelectric cooling films using organic materials for personal and large-area applications. The solution must achieve sub-one-inch bending radius and conformal contact to curved surfaces while prioritizing flexibility and cost over efficiency for niche cooling needs.
This summary is AI-generated from the official solicitation.
Key Details
Official Description
Thermoelectric cooling devices based on narrow bandgap semiconductors such as bismuth telluride are commercially available. They are solid state devices and thus do not have the large footprint and moving parts associated with vapor compression refrigeration systems; however, they operate with lower efficiency. They are well-suited for cooling small flat surfaces where one is more concerned with the form factor than efficiency. For many practical applications, these square ceramic tile thermoele...
Change History
Flexible Printed Thermoelectric Cooling Film
This Q&A clarifies that a single U.S. university research institution may serve as a research partner/subcontractor for multiple small businesses in separate STTR proposals, provided each proposal is distinct, technical approaches differ, confidential information remains separate, and any organizational conflicts of interest are disclosed and mitigated.
Flexible Printed Thermoelectric Cooling Film
Status changed from Pre-Release to Open
Flexible Printed Thermoelectric Cooling Film
Close Date changed from 2026-04-22 to 2026-06-03
Flexible Printed Thermoelectric Cooling Film
Open Date changed from 2026-03-25 to 2026-05-06
Flexible Printed Thermoelectric Cooling Film
Status changed from Removed to Pre-Release
Flexible Printed Thermoelectric Cooling Film
Opportunity DON26TZ01-NV013 no longer available
Flexible Printed Thermoelectric Cooling Film
New opportunity: Flexible Printed Thermoelectric Cooling Film
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