AUTOMATED PROCESS FOR CODESIGN OF RADIATION HARDENING AND SECURITY
AI Overview
DARPA seeks development of high-speed mixed-signal integrated circuits using wide-bandgap materials (SiC/GaN) that maintain performance in extreme temperatures exceeding 800°C. This addresses critical reliability gaps for defense missile systems, aerospace propulsion, and deep-space missions requiring precision electronics in harsh thermal environments.
This summary is AI-generated from the official solicitation.
Key Details
Official Description
To achieve mission objectives, many national security systems require microelectronics with some level of radiation resilience or hardness. Being embedded in national security systems, microelectronics often have security or trust requirements as well. However, radiation hardness and security are usually developed independently and in isolation from each other. This call for proposals is to co-develop approaches to simultaneously achieve both radiation resilience and security.
Radiation res...
Change History
AUTOMATED PROCESS FOR CODESIGN OF RADIATION HARDENING AND SECURITY
Status changed from Pre-Release to Open
AUTOMATED PROCESS FOR CODESIGN OF RADIATION HARDENING AND SECURITY
The opportunity shifted from developing high-temperature mixed-signal ICs (operating to 800°C) to developing microelectronics that co-achieve radiation resilience and security through automation and design techniques, with Phase II structured as a 12-month base plus two 12-month options rather than a single 36-month effort.
AUTOMATED PROCESS FOR CODESIGN OF RADIATION HARDENING AND SECURITY
New opportunity: AUTOMATED PROCESS FOR CODESIGN OF RADIATION HARDENING AND SECURITY
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